Samsung to Invest $7.2 Billion More in US Chip Manufacturing
Samsung is set to boost its US chip production capacity with an additional $7.2 billion investment, according to reports ahead of the South Korea–US summit on August 25. This new funding will be directed toward building a state-of-the-art advanced chip packaging facility, adding to the company’s already massive $37 billion commitment to American semiconductor manufacturing.
Next-Gen 2nm and 4nm Chips in Focus
The upcoming facility will focus on producing cutting-edge 2nm and 4nm chips, targeting growing demand from major tech clients like Apple and Tesla. Industry insiders suggest this expansion also positions Samsung to counter potential tariff challenges from the Trump administration.
This plan revives an earlier proposal from Samsung’s initial $44 billion investment blueprint, which had been scaled back when global chip demand slowed.
A Complete Semiconductor Solution in the US
Unlike rivals TSMC and SK Hynix, Samsung aims to offer a full semiconductor solution in America—covering manufacturing, packaging, and memory chip production. This could give the company a strong competitive edge in the US tech market.
Progress at Taylor Fab 1
Samsung’s flagship US plant, Taylor Fab 1, is nearing completion and is expected to be ready by the end of 2025. However, full-scale production will only begin after manufacturing equipment installation in 2026.
While the $7.2 billion figure is yet to be officially confirmed, industry experts believe Samsung will announce the expansion during the upcoming summit. If approved, this will mark another major milestone in Samsung’s bid to dominate the next generation of semiconductor technology.
